Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2003
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Application #:
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09743181
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Filing Dt:
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01/05/2001
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Inventors:
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Junya Yoshitake, Tetsuo Ogawa, Kenji Seko, Yutaka Yoshikawa, Jun Akui, Satoru Furusawa
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Title:
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WATER-BASED SOLDER RESIST COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 33-1, KANSAKI-CHO, AMAGASAKI-SHI |
| HYOGO 661-0964, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI, MCLELAND |
| & NAUGHTON , LLP |
| 1725 K STREET, N.W., SUITE 1000 |
| WASHINGTON, D.C 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AMAGASAKI-SHI |
| 33-1, KANZAKI-CHO |
| HYOGO-661-0964, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI, ET AL |
| LE-NHUNG MCLELAND |
| 1725 K STREET N.W. |
| SUITE 1000 |
| WASHINGTON, D.C. 20006 |
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