Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
08/12/2003
|
Application #:
|
10152468
|
Filing Dt:
|
05/21/2002
|
Inventors:
|
Yu-Te Hsieh, Shyh-Ming Chang, Wen-Ti Lin
|
Title:
|
METHOD FOR BONDING IC CHIPS TO SUBSTRATES WITH NON-CONDUCTIVE ADHESIVE AND ASSEMBLIES FORMED
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
ROOM 51-103, TTSC/B100 |
195 SECTION 4, CHUNG HSING ROAD |
CHUTUNG, HSINCHU, TAIWAN 310 R |
|
|
|
TUNG & ASSOCIATES |
RANDY W. TUNG |
838 W. LONG LAKE ROAD |
SUITE 120 |
BLOOMFIELD HILLS, MI 48302 |
|
|
Search Results as of:
05/25/2024 09:37 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|