Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/19/2003
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Application #:
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09975470
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Filing Dt:
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10/09/2001
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Publication #:
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Pub Dt:
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04/11/2002
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Inventors:
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Young-Hoon Ro, Jung-Hwan Chun, Heung-Kyu Kwon
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Title:
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SEMICONDUCTOR CHIP PACKAGE HAVING ONE OR MORE SEALING SCREWS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, PALDAL-KU, SUWON-CITY |
| KYUNGKI-D0, KOREA, REPUBLIC OF |
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| MARGET JOHNSON & MCCOLLOM, P.C. |
| ALAN T. MCCOLLUM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OREGON 97205 |
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