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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/19/2003
Application #:
10054231
Filing Dt:
11/13/2001
Publication #:
Pub Dt:
05/15/2003
Inventors:
David T. Beatson, Andrew F. Hmiel
Title:
WIREBONDED SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE
Assignment: 1
Reel/Frame:
012903/0166Recorded: 05/13/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2001
Exec Dt:
11/13/2001
Assignee:
LITTLE FALLS CENTER II
2751 CENTERVILLE ROAD
WILMINGTON, DELAWARE 19808
Correspondent:
TOWNSEND AND TOWNSEND AND CREW LLP
WILLIAM L. SHAFFER
TWO EMBARCADERO CENTER 8TH FLOOR
SAN FRANCISCO, CA 94111-3834
Assignment: 2
Reel/Frame:
017718/0533Recorded: 06/05/2006Pages: 6
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/21/2005
Assignee:
1005 VIRGINIA DRIVE
FORT WASHINGTON, PENNSYLVANIA 19034
Correspondent:
CHRISTOPHER M. SPLETZER, SR.
1005 VIRGINIA DRIVE
FORT WASHINGTON, PA 19034

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