Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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10006367
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Filing Dt:
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12/10/2001
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Publication #:
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Pub Dt:
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06/13/2002
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Inventor:
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Akira Furuya
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Title:
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METHOD FOR FORMING BARRIER LAYERS FOR
SOLDER BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MINATO-KU |
| 7-1 SHIBA 5-CHOME |
| TOKYO 108-01, JAPAN |
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| YOUNG & THOMPSON |
| BENOIT CASTEL |
| SECOND FLOOR |
| 745 SOUTH 23RD STREET |
| ARLINGTON, VA 22202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI |
| KANAGAWA 211-8668, JAPAN |
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| YOUNG & THOMPSON |
| BENOIT CASTEL |
| SECOND FLOOR |
| 745 SOUTH 23RD STREET |
| ARLINGTON, VA 22202 |
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