Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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09803519
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Filing Dt:
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03/09/2001
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Publication #:
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Pub Dt:
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09/12/2002
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Inventors:
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Craig W. Warner, Jay S. Tsao
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Title:
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SCALABLE TRANSPORT LAYER PROTOCOL FOR MULTIPROCESSOR INTERCONNECTION NETWORKS THAT TOLERATES INTERCONNECTION COMPONENT FAILURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 272400 |
| FORT COLLINS, COLORADO 80527 |
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| HEWLETT-PACKARD COMPANY |
| MARCI SANTILLANES |
| LEGAL DEPT. MS 79 |
| 3404 E. HARMONY ROAD |
| FORT COLLINS, CO 80528 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| CURTIS G. ROSE |
| P.O. BOX 272400 |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3300 OLCOTT STREET |
| SANTA CLARA, CALIFORNIA 95054 |
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| VAN PELT, YI & JAMES LLP |
| 10050 N. FOOTHILL BLVD. |
| SUITE 200 |
| CUPERTINO, CA 95014 |
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