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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/09/2003
Application #:
10140286
Filing Dt:
05/08/2002
Publication #:
Pub Dt:
01/09/2003
Inventors:
Woo Chan Jung, Jong Koo Lee
Title:
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND FORMING INTERLAYER DIELECTRIC FILM USING HIGH-DENSITY PLASMA
Assignment: 1
Reel/Frame:
012881/0443Recorded: 05/08/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/23/2002
Exec Dt:
04/23/2002
Assignee:
416, MAETAN-DONG, PALDAL-GU
SUWONG-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
VOLENTINE FRANCOS, P.L.L.C.
KENNETH D. SPRINGER
12200 SUNRISE VALLEY DRIVE, SUITE 150
RESTON, VIRGINIA 20191
Assignment: 2
Reel/Frame:
034151/0504Recorded: 11/04/2014Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/05/2014
Assignee:
10F GOLDEN TOWER BLDG.
511, SAMSEONG-RO, GANGNAM-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
LEVENFELD PEARLSTEIN, LLC
2 N. LASALLE STREET
SUITE 1300
CHICAGO, IL 60602

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