Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/09/2003
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Application #:
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10116573
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Filing Dt:
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04/04/2002
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Publication #:
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Pub Dt:
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10/24/2002
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Inventors:
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Richard F. Hill, Jason L. Strader
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Title:
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MULTI-LAYER STRUCTURE AND METHOD FOR FORMING A THERMAL INTERFACE WITH LOW CONTACT RESISTANCE BETWEEN A MICROELECTRONIC COMPONENT PACKAGE AND HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4707 DETROIT AVENUE |
| CLEVELAND, OHIO 44102 |
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| ANDERSON KILL & OLICK, P.C. |
| EUGENE LIEBERSTEIN |
| 1251 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 3481 RIDER TRAIL SOUTH |
| EARTH CITY, MISSOURI 63045 |
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| HUSCH BLACKWELL LLP |
| 190 CARONDELET PLAZA |
| SUITE 600 |
| ST. LOUIS, MO 63105 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 104 LA MESA DRIVE, SUITE 102 |
| PORTOLA VALLEY, CALIFORNIA 94028 |
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| NATASCHA SUST |
| 1 FRONT STREET |
| SUITE 3200 |
| SAN FRANCISCO, CA 94111 |
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