Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/16/2003
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Application #:
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10035173
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Filing Dt:
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01/04/2002
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Publication #:
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Pub Dt:
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06/27/2002
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Inventors:
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Rieko Yamamoto, Kyoichi Yoda
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Title:
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LIQUID THERMOSETTING INSULATING RESIN COMPOSITION AND METHOD FOR PERMANENTLY FILLING HOLES IN PRINTED CIRCUIT BOARD BY THE USE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, HAZAWA 2-CHOME, NERIMA-KU |
| TOKYO, JAPAN |
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| RADER, FISHMAN & GRAUER |
| RONALD P. KANANEN, ESQ. |
| 1233 20TH STREET, NW - SUITE 501 |
| WASHINGTON, D.C. 20036 |
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