Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/23/2003
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Application #:
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09716463
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Filing Dt:
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11/21/2000
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Inventor:
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Takao Kazama
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STRUCTURE WITH REDUCED BOND WIRE DEFORMATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-12 TORANOMON 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN |
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| RABIN & CHAMPAGNE, P.C. |
| STEVEN M. RABIN |
| 1101 14TH STREET, N.W. |
| SUITE 500 |
| WASHINGTON, D.C. 20005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 550-1 HIGASHIASAKAWA-CHO |
| HACHIOJI-SHI, TOKYO, JAPAN 193-8550 |
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| KUBOTERA & ASSOCIATES, LLC |
| 200 DAINGERFIELD ROAD, SUITE 202 |
| ALEXANDRIA, VIRGINIA 22314 |
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