Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/21/2003
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Application #:
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10161471
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Filing Dt:
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05/30/2002
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Inventors:
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Timothy B. Billman, Iosif R. Korsunsky
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Title:
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HIGH DENSITY ELECTRICAL CONNECTOR WITH IMPROVED GROUNDING BUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66 CHUNG SHAN ROAD |
| TU-CHEN, TAIPEI HSIEN, TAIWAN |
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| FOXCONN INTL., INC. |
| WEI TE (JOSEPH) CHUNG |
| 1650 MEMOREX DRIVE |
| SANTA CLARA, CALIFORNIA 95050 |
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