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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
10/28/2003
Application #:
10132407
Filing Dt:
04/26/2002
Publication #:
Pub Dt:
10/31/2002
Inventor:
Da Soon Lee
Title:
Method for fabricating a high voltage device
Assignment: 1
Reel/Frame:
012848/0020Recorded: 04/26/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/10/2002
Assignee:
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI
KYOUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT
MR. ERNEST F. CHAPMAN
1300 I STREET, N.W.
WASHINGTON, D.C. 20005-3315
Assignment: 2
Reel/Frame:
016216/0649Recorded: 01/10/2005Pages: 93
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/04/2004
Assignee:
1 HYANGJEONG-DONG, HEUNGDUK
CHEONGJU CITY, CHUNG CHEONG BOK-DO, KOREA, REPUBLIC OF
Correspondent:
MATTHEW T. SMITH
DECHERT LLP
4000 BELL ATLANTIC TOWER
1717 ARCH STREET
PHILADELPHIA, PA 19103-2793
Assignment: 3
Reel/Frame:
022764/0270Recorded: 05/30/2009Pages: 106
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/14/2009
Assignee:
2711 CENTERVILLE ROAD, SUITE 400
WILMINGTON, DELAWARE 19808
Correspondent:
OMIKRON IP LAW GROUP
525 1ST STREET, SUITE 112
LAKE OSWEGO, OR 97034

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