Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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10122897
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Filing Dt:
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04/11/2002
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Publication #:
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Pub Dt:
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06/19/2003
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Inventor:
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Chi-Hsing Hsu
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Title:
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MULTI-CHIP PACKAGE WITH EMBEDDED COOLING ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F, NO. 553, CHUNG-CHENG RD., |
HSIN-TIEN CITY, TAIPEI HSIEN,, TAIWAN R.O.C |
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J.C. PATENTS, INC. |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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