Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/11/2003
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Application #:
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10093894
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Filing Dt:
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03/11/2002
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Publication #:
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Pub Dt:
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11/21/2002
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Inventor:
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Makoto Ohkawa
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Title:
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METHOD OF MEASURING THICKNESS OF A SEMICONDUCTOR LAYER AND METHOD OF MANUFACTURING A SEMICONDUCTOR SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO, KARIYA-CITY |
| AICHI-PREF. 448-8661, JAPAN |
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| LAW OFFICES OF DAVID G. POSZ |
| DAVID G. POSZ |
| 2000 L STREET, NW. |
| STE. 200 |
| WASHINGTON, DC 20036 |
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