Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/11/2003
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Application #:
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10077822
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Filing Dt:
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02/20/2002
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Publication #:
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Pub Dt:
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08/21/2003
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Inventors:
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Sarah E. Kim, R. Scott List, Tom Letson
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Title:
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ETCH STOP LAYER FOR SILICON (SI) VIA ETCH IN THREE-DIMENSIONAL (3-D) WAFER-TO-WAFER VERTICAL STACK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD, SC4-202 |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANTONELLI, TERRY ET AL |
| 1300 N. SEVENTEENTH ST. |
| STE. 1800 |
| ARLINGTON, VA 22209 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SC4-202 |
| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANTONELLI, TERRY, STOUT ET AL. |
| HUNG H. BUI |
| 1300 NORTH 17TH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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