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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/09/2003
Application #:
10038199
Filing Dt:
12/21/2001
Publication #:
Pub Dt:
05/30/2002
Inventors:
Sang-Ho Yu, Yonghwa Chris Cha, Murali Abburi, Shri Singhvi, Fufa Chen
Title:
STAGED ALUMINUM DEPOSITION PROCESS FOR FILLING VIAS
Assignment: 1
Reel/Frame:
012509/0611Recorded: 12/21/2001Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/10/1999
Exec Dt:
07/07/1999
Exec Dt:
07/07/1999
Exec Dt:
08/09/1999
Exec Dt:
07/20/1999
Assignee:
P.O. BOX 450-A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS, INC.
DONALD VERPLANCKEN
P.O. BOX 450-A
SANTA CLARA, CA 95052

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