Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10137790
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Filing Dt:
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05/01/2002
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Publication #:
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Pub Dt:
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11/06/2003
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Inventors:
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Hiroaki Yanagida, Hideaki Matsubara, Yoshiki Okuhara, Naoki Kawashima, Toshio Uehara et al
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Title:
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PLATEN FOR ELECTROSTATIC WAFER CLAMPING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ATSUTA-KU |
| 2-4-1 MUTSUNO |
| NAGOYA, JAPAN 456-8 |
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| 1-21-10 HIGASHI GOTANDA |
| SUMITOMO MARINE BLDG. |
| SHINAGAWA-KU, TOKYO, JAPAN 141-0 |
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| 1-21-10 HIGASHI GOTANDA |
| 11601 MAPLE RIDGE ROAD |
| MEDINA, NEW YORK 14103 |
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| HODGSON RUSS LLP |
| MARTIN G. LINIHAN |
| ONE M&T PLAZA |
| SUITE 2000 |
| BUFFALO, NY 14203-2391 |
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