Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10019299
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Filing Dt:
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03/11/2002
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Inventors:
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Johshi Gotoh, Tatsuya Okuno
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Title:
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UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, AKETA-CHO |
| TAKATSUKI-SHI, OSAKA-FU, JAPAN |
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| JACOBSON HOLMAN PLLC |
| WILLIAM E. PLAYER |
| 400 SEVENTH STREET, N.W. |
| WASHINGTON, D.C. 20004 |
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Assignment:
2
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RE-RECORD TO ADD OMITTED SECOND ASSGINEE, PREVIOUSLY RECORDED AT REEL 012667, FRAME 0706.
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| 7-1, AKETA-CHO, TAKATSUKI-SHI |
| OSAKA-FU, JAPAN |
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| STRAWINSKYLAAN 3019 |
| ATRIUM 1HG, AMSTERDAM, NETHERLANDS 1077 |
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| JACOBSON HOLMAN PLLC |
| WILLIAM E. PLAYER |
| 400 SEVENTH STREET, NW |
| WASHINGTON, D.C. 20004-2218 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VICTORIA HOUSE, ROUTE DE LA PIERRE, 22 |
| ECUBLENS, SWITZERLAND 1024 |
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| JACOBSON HOLMAN PLLC |
| 400 SEVENTH STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20004 |
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