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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6661097
Issue Dt:
12/09/2003
Application #:
10287155
Filing Dt:
11/01/2002
Inventors:
Larry Clevenger, Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino et al
Title:
TI LINER FOR COPPER INTERCONNECT WITH LOW-K DIELECTRIC AND METHODS FOR MAKING THE SAME
Assignment: 1
Reel/Frame:
013477/0618Recorded: 11/01/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LU, HSIAO-LING
Exec Dt:
10/14/2002
YANG, CHIH-CHAO
Exec Dt:
10/10/2002
Assignee:
UNITED MICROELECTRONICS, CO.
NO. 3, LI-HSIN ROAD II
HSIN-CHU 30077, TAIWAN ROC
Correspondent:
IBM CORPORATION
IRA D. BLECKER
DEPT. 18G/BLDG. 300-482
2070 ROUTE 52
HOPEWELL JUNCTION, NY 12533-6531
Assignment: 2
Reel/Frame:
013477/0526Recorded: 11/01/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CLEVENGER, LARRY
Exec Dt:
10/24/2002
KLEPIS, STANLEY J.
Exec Dt:
10/09/2002
MARINO, JEFFREY R.
Exec Dt:
10/13/2002
SIMON, ANDREW H.
Exec Dt:
10/15/2002
WANG, YUN-YU
Exec Dt:
10/09/2002
WONG, KWON HON
Exec Dt:
10/23/2002
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
IRA D. BLECKER
INTELLECTUAL PROPERTY LAW DEPT.
2070 ROUTE 52
HOPEWELL JUNCTION, NY 12533-6531

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