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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/16/2003
Application #:
09996425
Filing Dt:
11/27/2001
Inventors:
Tatyana N. Andryuschenko, Jonathan D. Reid, Steven T. Mayer, Eric G. Webb
Title:
ELECTROLESS COPPER DEPOSITION METHOD FOR PREPARING COPPER SEED LAYERS
Assignment: 1
Reel/Frame:
013545/0939Recorded: 12/04/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/06/2001
Exec Dt:
11/06/2001
Assignee:
7980 EAST AMERICAN DRIVE
JOPLIN, MISSOURI 64804
Correspondent:
JOHN S. MUNDAY
POST OFFICE BOX 423
ISANTI, MN 55040
Assignment: 2
Reel/Frame:
012334/0829Recorded: 11/30/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/20/2001
Exec Dt:
11/19/2001
Exec Dt:
11/19/2001
Exec Dt:
11/19/2001
Assignee:
3970 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95134
Correspondent:
BEYER WEAVER & THOMAS, LLP
JEFFREY K. WEAVER
P.O. BOX 778
BERKELEY, CA 94704-0778

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