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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/30/2003
Application #:
10021257
Filing Dt:
12/19/2001
Publication #:
Pub Dt:
06/20/2002
Inventors:
Akira Chinda, Akira Matsuura
Title:
WIRING BOARD, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION OF WIRING BOARD
Assignment: 1
Reel/Frame:
012400/0509Recorded: 12/19/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/28/2001
Exec Dt:
11/28/2001
Assignee:
6-1, OTEMACHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
FOLEY & LARDNER
GLENN LAW
3000 K STREET, N.W., SUITE 500
WASHINGTON HARBOUR
WASHINGTON, D.C. 20007-5143
Assignment: 2
Reel/Frame:
032134/0723Recorded: 01/29/2014Pages: 33
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/01/2013
Assignee:
2-1, SHIBAURA 1-CHOME MINATO-KU
TOKYO, JAPAN
Correspondent:
FOLEY & LARDNER LLP
3000 K STREET NW
WASHINGTON, DC 20007

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