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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/13/2004
Application #:
10004977
Filing Dt:
12/03/2001
Inventors:
Visvamohan Yegnashankaran, Gobi R. Padmanabhan
Title:
SILICON DIE WITH METAL FEED THROUGH STRUCTURE
Assignment: 1
Reel/Frame:
012359/0362Recorded: 12/03/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2001
Exec Dt:
11/28/2001
Assignee:
2900 SEMICONDUCTOR DRIVE, M/S D3-579
SANTA CLARA, CALIFORNIA 95051
Correspondent:
PILLSBURY WINTHROP LLP
MARK C. PICKERING, ESQ.
50 FREMONT STREET, 5TH FLOOR
SAN FRANCISCO, CA 94105

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