Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/27/2004
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Application #:
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09297288
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Filing Dt:
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04/29/1999
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Publication #:
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Pub Dt:
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03/14/2002
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Inventors:
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KIYOSHI SAWADA, TOMOHIKO KAWAI
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Title:
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DIRECT BONDING OF SMALL PARTS AND MODULE OF COMBINED SMALL PARTS WITHOUT AN INTERMEDIATE LAYER INBETWEEN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OSHINO-MURA, MINAMITSURU-GUN |
| 3580, SHIBOKUSA AZA-KOMANBA |
| YAMANASHI, 401-0597, JAPAN |
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| STAAS & HALSEY |
| JAMES D. HALSEY, JR. |
| 700 ELEVENTH STREET, N.W. |
| SUITE 500 |
| WASHINGTON, D.C. 20001 |
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