Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/03/2004
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Application #:
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09879876
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Filing Dt:
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06/11/2001
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Publication #:
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Pub Dt:
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12/12/2002
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Inventors:
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Michael J. Regan, John Liebeskind, Charles C. Haluzak
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Title:
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MULTI-LEVEL INTEGRATED CIRCUIT FOR WIDE-GAP SUBSTRATE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INTELLECTUAL PROPERTY ADMINISTRATION |
| PO BOX 272400 |
| FORT COLLINS, COLORADO 80527 |
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| HEWLETT-PACKARD COMPANY |
| TERESA K. TUMA |
| 1000 NE CIRCLE BLVD. |
| MS 422B |
| CORVALLIS OR 97330 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| GUY J. KELLEY |
| P.O. BOX 272400, RECORDS MANAGER |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8 LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| DAVID M. O'DELL |
| HAYNES AND BOONE, LLP - IP SECTION |
| 2323 VICTORY AVENUE, SUITE 700 |
| DALLAS, TX 75219 |
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