Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/03/2004
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Application #:
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10340961
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Filing Dt:
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01/13/2003
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Inventors:
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Wei H. Koh, Fred Kong, Daniel Hsu
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Title:
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INTEGRATED MULTI-CHIP CHIP SCALE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 17600 NEWHOPE STREET |
| FOUNTAIN VALLEY, CALIFORNIA 92708 |
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| MORLAND C. FISCHER |
| 2030 MAIN STREET |
| SUITE 1050 |
| IRVINE, CA 92614 |
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