Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/02/2004
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Application #:
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09958911
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Filing Dt:
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10/15/2001
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Inventors:
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Yushi Horiuchi, Shigeaki Kuroi
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Title:
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METHOD FOR MANUFACTURING SI-SIC MEMBER FOR SEMICONDUCTOR HEAT TREATMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-25, NISHI-SHINJUKU 7-CHOME, SHINJUKU-KU |
| TOKYO 163-0023, JAPAN |
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| FOLEY & LARDNER |
| RICHARD L. SCHWAAB |
| WASHINGTON HARBOUR |
| 3000 K ST., N.W., SUITE 500 |
| WASHINGTON, D.C. 20007-5109 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 6-3, OHSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN |
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| DAVID J. CUSHING - SUGHRUE MION PLLC |
| 20-20, KAIGAN 3-CHOME, MINATO-KU |
| SUITE 800 |
| WASHINGTON, D.C, DC 20037 |
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