Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/02/2004
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Application #:
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09946903
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Filing Dt:
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09/05/2001
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Publication #:
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Pub Dt:
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09/26/2002
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Inventors:
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Chien-Ping Huang, Tzong-Da Ho, Cheng-Hsu Hsiao
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Title:
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SUBSTRATE OF SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN, |
| IP GROUP; PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA |
| U.S.A. 02209 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT PREVIOUSLY RECORDED AT REEL 012158 FRAME 0375. (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD TANTZU, |
| TAICHUNG R.O.C., TAIWAN |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| PO BOX 9169 |
| BOSTON, MA 02209 |
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