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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/02/2004
Application #:
09870684
Filing Dt:
06/01/2001
Publication #:
Pub Dt:
02/21/2002
Inventors:
Yoshihisa Yamashita, Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo
Title:
THERMALLY CONDUCTIVE SUBSTRATE, THERMALLY CONDUCTIVE SUBSTRATE MANUFACTURING METHOD AND POWER MODULE
Assignment: 1
Reel/Frame:
012095/0535Recorded: 08/21/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Assignee:
1006, OAZA KADOMA, KADOMA-SHI
OSAKA 571-8501, JAPAN
Correspondent:
MORRISON & FOERSTER LLP
BARRY E. BRETSCHNEIDER
2000 PENNSYLVANIA AVENUE, N.W.
WASHINGTON, DC 20006-1888

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