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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/16/2004
Application #:
10338120
Filing Dt:
01/07/2003
Inventors:
Jing-Cheng Lin, Cheng-Lin Huang, Winston Shue, Mong-Song Liang
Title:
BARRIER-FREE COPPER INTERCONNECT
Assignment: 1
Reel/Frame:
013647/0824Recorded: 01/07/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/25/2002
Exec Dt:
09/25/2002
Exec Dt:
09/25/2002
Exec Dt:
09/25/2002
Assignee:
121 PARK AVE. 3
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN R.O.C.
Correspondent:
GEORGE O. SAILE
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603
Assignment: 2
Reel/Frame:
013657/0254Recorded: 01/09/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/23/2002
Exec Dt:
12/23/2002
Assignee:
10-1, NAKAZAWA-CHO
HAMAMATSU-SHI
SHIZUOKA-KEN, JAPAN
Correspondent:
MORRISON & FOERSTER LLP
DAVID L. FEHRMAN
555 WEST FIFTH STREET
SUITE 3500
LOS ANGELES, CA 90013-1024X

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