Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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09568558
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Filing Dt:
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05/09/2000
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Inventors:
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Luu Nguyen, Cade Murray, Peter Deane, Chen-Hui Tsay
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Title:
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ARRAYABLE, SCALEABLE, AND STACKABLE MOLDED PACKAGE CONFIGURATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| BEYER WEAVER & THOMAS, LLP |
| STEVE D. BEYER |
| PO BOX 130 |
| MOUNTAIN VIEW, CA 94042-0130 |
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