Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10385681
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Filing Dt:
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03/12/2003
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Inventors:
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Han-Kun Hsieh, Wei-Feng Lin, Yi-Chang Hsieh
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Title:
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CHIP-PACKAGING SUBSTRATE AND TEST METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 16 CREATION RD. 1 |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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BIRCH, STEWART, KOLASCH & BIRCH, LLP |
JOE MCKINNEY |
P.O. BOX 747 |
FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2711 CENTERVILLE ROAD, SUITE 400 |
WILMINGTON, DELAWARE 19808 |
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TRANSPACIFIC IP LTD. |
RM.1402, 14TH FL. NO.205, DUNHUA N. RD. |
TAIPEI CITY, 105 TAIWAN |
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