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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/30/2004
Application #:
09544263
Filing Dt:
04/06/2000
Inventors:
Jane Lu, Paul Wu, Ray Chen, Scott Chen, Jeff Chang
Title:
METHOD OF MAKING METAL CORE SUBSTRATE PRINTED CIRCUIT WIRING BOARD ENABLING THERMALLY ENCHANCED BALL GRID ARRY (BGA) PACKAGES
Assignment: 1
Reel/Frame:
011357/0040Recorded: 12/08/2000Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/26/2000
Exec Dt:
10/06/2000
Assignee:
PING CHEN, TAOYUAN HSIEN
5, KUNG-YEH 3RD ROAD, PING CHEN INDUSTRIAL ZONE
TAIWAN R.O.C.
Correspondent:
JIM ZEGEER
801 N. PITT STREET, #108
ALEXANDRIA, VA 22314

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