Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/30/2004
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Application #:
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10249369
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Filing Dt:
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04/03/2003
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Publication #:
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Pub Dt:
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02/12/2004
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Inventors:
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Kun-Ching Chen, Ho-Ming Tong, Chun-Chi Lee
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Title:
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FLIP CHIP PACKAGE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN 811 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2300 KIN KE ROAD,ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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