Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/13/2004
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Application #:
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10120836
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Filing Dt:
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04/11/2002
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Publication #:
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Pub Dt:
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10/16/2003
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Inventors:
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John Leonard Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta et al
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Title:
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METHOD OF USING HYDROGEN PLASMA TO PRE-CLEAN COPPER SURFACES DURING CU/CU OR CU/METAL BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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STREET 2 |
60 WOODLANDS INDUSTRIAL PARK D |
SINGAPORE, SINGAPORE 73840 |
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GEORGE O. SAILE |
20 MCINTOSH DRIVE |
POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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RE-RECORD TO CORRECT THE INVENTOR NAME PREVIOUSLY RECORDED AT REEL/FRAME 012791/0608.
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60 WOODLANDS INDUSTRIAL PARK D |
STREET 2 |
SINGAPORE, SINGAPORE 738406 |
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GEORGE O. SAILE |
28 DAVIS AVENUE |
POUGHKEEPSIE, NY 12603 |
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