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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/13/2004
Application #:
10120836
Filing Dt:
04/11/2002
Publication #:
Pub Dt:
10/16/2003
Inventors:
John Leonard Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta et al
Title:
METHOD OF USING HYDROGEN PLASMA TO PRE-CLEAN COPPER SURFACES DURING CU/CU OR CU/METAL BONDING
Assignment: 1
Reel/Frame:
012791/0608Recorded: 04/11/2002Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Assignee:
STREET 2
60 WOODLANDS INDUSTRIAL PARK D
SINGAPORE, SINGAPORE 73840
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603
Assignment: 2
Reel/Frame:
013734/0958Recorded: 02/11/2003Pages: 8
Conveyance:
RE-RECORD TO CORRECT THE INVENTOR NAME PREVIOUSLY RECORDED AT REEL/FRAME 012791/0608.
Assignors:
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Exec Dt:
06/01/2000
Assignee:
60 WOODLANDS INDUSTRIAL PARK D
STREET 2
SINGAPORE, SINGAPORE 738406
Correspondent:
GEORGE O. SAILE
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603

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