Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10136484
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Filing Dt:
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05/02/2002
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Publication #:
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Pub Dt:
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02/06/2003
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Inventors:
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Noriyuki Takasaki, Kenji Takayama, Kazuo Noda
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Title:
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PROCESS FOR PRODUCTION OF EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHISHINAGAWA, 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN |
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| SMITH, GAMBRELL & RUSSELL, LLP |
| ROBERT G. WEILACHER |
| 1850 M STREET NW - SUITE 800 |
| WASHINGTON, D.C. 20036 |
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