Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10070472
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Filing Dt:
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03/07/2002
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Inventors:
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Hiromu Shiomi, Tsunenobu Kimoto, Hiroyuki Matsunami
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Title:
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SIC WAFER, SIC SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD OF SIC WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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27-1, SAIIN-HIDERICHO, UKYO-KU, KYOTO-SHI |
KYOTO 615-0065, JAPAN |
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3-3-22, NAKANOSHIMA, KITA-KU, OSAKA-SHI |
OSAKA 530-8270, JAPAN |
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6-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
TOKYO 100-8086, JAPAN |
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5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI |
OSAKA 541-0041, JAPAN |
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MCDERMOTT, WILL & EMERY |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3-6-16, NAKANOSHIMA, KITA-KU |
OSAKA-SHI, OSAKA 530-8270, JAPAN |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, D.C. 20005-3096 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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27-1, SAIIN HIDERI-CHO, UKYO-KU |
KYOTO-SHI, KYOTO, JAPAN 616-0065 |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, D.C. 20005-3096 |
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Assignment:
4
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VERIFIED STATEMENT CORRECTING COMPANY NAME
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27-1, SAIIN HIDERI-CHO, UKYO-KU |
KYOTO-SHI, KYOTO 616-0065, JAPAN |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, D.C. 20005-3096 |
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Assignment:
5
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI |
OSAKA, JAPAN 541-0041 |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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