Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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09766654
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Filing Dt:
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01/23/2001
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Publication #:
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Pub Dt:
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07/25/2002
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Inventor:
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Todd O. Bolken
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Title:
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SEMICONDUCTOR ASSEMBLY ENCAPSULATION MOLD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP |
| THOMAS J. D'AMICO |
| 2101 L STREET NW |
| WASHINGTON, DC 20037-1526 |
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| DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP |
| THOMAS J. D'AMICO |
| 2101 L STREET NW |
| WASHINGTON, D.C. 20037-1526 |
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