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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	6736907	Issue Dt:	05/18/2004	Application #:	10308167	Filing Dt:	12/03/2002
Publication #:	20030121564	Pub Dt:	07/03/2003
Inventors:	Toshihiko Taguchi, Kunihito Takaura, Masahiko Hirata, Hisahiko Yoshida et al
Title:	SOLDER PASTE

Assignment: 1

Reel/Frame:

Recorded: 03/04/2003

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

Exec Dt:

01/28/2003

Exec Dt:

01/30/2003

Exec Dt:

02/12/2003

Exec Dt:

02/12/2003

Exec Dt:

02/12/2003

Assignees:

23 SENJU-HASHIDO-CHO

ADACHI-KU, TOKYO 120-8555, JAPAN

1006, OAZA KADOMA, KADOMA-SHI

OSAKA 571-8501, JAPAN

Correspondent:

MICHAEL TOBIAS

#40

1717 K STREET, N.W., SUITE 613

WASHINGTON, D.C. 20036

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