Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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09791840
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Filing Dt:
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02/26/2001
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Publication #:
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Pub Dt:
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08/30/2001
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Inventors:
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Hirofumi Ishida, Yoshiyuki Harima
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Title:
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WAFER PLATING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-CHOME, CHUO-KU |
| 6-6 NIHONBASHIKAYABA-CHO |
| TOKYO 103-0025, JAPAN |
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| 3-6 AKASAKA, 5-CHOME, MINATO-KU |
| TBW BROADCASTING CENTER |
| TOKYO 107-8491, JAPAN |
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| ARENT FOX KINTNER & KAHN PLLC |
| ROBERT B. MURRAY |
| 1050 CONNECTICUT AVENUE, N.W. |
| SUITE 600 |
| WASHINGTON, D.C. 20036-5339 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6,6 NIHONBASHIKAYABA-CHO 2-CHOME, CHUO-KU |
| TOKYO 103-0025, JAPAN |
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| TBS BROADCASTING CENTER |
| 3-6, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO 107-8481, JAPAN |
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| ROTHWELL, FIGG, ERNST & MANBECK |
| ROBERT B. MURRAY |
| 1425 K ST., N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20005 |
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