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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/18/2004
Application #:
10410188
Filing Dt:
04/10/2003
Publication #:
Pub Dt:
10/30/2003
Inventors:
Yoshio Shimoida, Saichirou Kaneko, Hideaki Tanaka, Masakatsu Hoshi
Title:
WIDE BANDGAP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
013966/0697Recorded: 04/10/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/21/2003
Exec Dt:
03/28/2003
Exec Dt:
03/25/2003
Exec Dt:
03/25/2003
Assignee:
2, TAKARA-CHO, KANAGAWA-KU
YOKOHAMA-SHI
KANAGAWA-KEN, JAPAN
Correspondent:
MCDERMOTT, WILL & EMERY
ROBERT L. PRICE
600 13TH STREET, N.W.
WASHINGTON, DC 20005

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