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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/25/2004
Application #:
09531163
Filing Dt:
03/17/2000
Inventors:
Hiroyuki Yano, Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Akira Iio et al
Title:
AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WIRING
Assignment: 1
Reel/Frame:
010925/0545Recorded: 06/21/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/03/2000
Exec Dt:
03/07/2000
Exec Dt:
03/07/2000
Exec Dt:
03/07/2000
Exec Dt:
03/13/2000
Exec Dt:
03/13/2000
Assignees:
72, HORIKAWA-CHO, SAIWAI-KU
KAWASAKI-SHI, KANAGAWA, JAPAN
2-11-24, TUKIJI, CHUO-KU
TOKYO, JAPAN
Correspondent:
OBLON, SPIVAK, MC CLELLAND, MAIER, ET AL
1755 JEFFERSON DAVIS HWY
ARLINGTON, VA. 22202
NORMAN F. OBLON
Assignment: 2
Reel/Frame:
043727/0167Recorded: 09/28/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/05/2017
Assignee:
1-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVE, NW SUITE 800
WASHINGTON, DC 20037-3213

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