Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/22/2004
|
Application #:
|
10254990
|
Filing Dt:
|
09/25/2002
|
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
|
Inventors:
|
Hiroshi Nagata, Yoshiyuki Goh
|
|
Title:
|
THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL AND SEMICONDUCTOR DEVICE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
|
|
|
|
| SMITH, GAMBRELL & RUSSELL, LLP |
| ROBERT G. WEILACHER, ESQ. |
| SUITE 3100, PROMENADE II |
| 1230 PEACHTREE STREET, N.E. |
| ATLANTA, GEORGIA 30309-3592 |
|
|
Search Results as of:
04/28/2024 06:15 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
