Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10042829
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Filing Dt:
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01/08/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Inventors:
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Chi Wah Cheng, Ping Chun Chong, Chi Fung Chan, Chin Pang Chan
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Title:
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APPARATUS AND METHOD OF PLACING SOLDER BALLS ONTO A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4/F., WATSON CENTRE |
| 16 KUNG YIP ST. |
| KWAI CHUNG, HONG KONG |
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| OSTROLENK, FABER, GERB ET AL. |
| ROBERT C. FABER |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 1036-8403 |
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Assignment:
2
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CORRECTIVE TO CORRECT THE FOURTH ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 012807 FRAME 0678. (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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| 4/F., WATSON CENTRE |
| 16 KUNG YIP ST. |
| KWAI CHUNG, HONG KONG |
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| OSTROLENK, FABER, GERB & SOFFEN, LLP |
| ROBERT C. FABER |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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