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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/27/2004
Application #:
09860514
Filing Dt:
05/21/2001
Publication #:
Pub Dt:
01/03/2002
Inventors:
Tetsuo Matsuda, Hisashi Kaneko, Koji Mishima, Natsuki Makino, Junji Kunisawa
Title:
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
Assignment: 1
Reel/Frame:
012079/0344Recorded: 08/15/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/2001
Exec Dt:
06/21/2001
Exec Dt:
06/21/2001
Exec Dt:
06/21/2001
Exec Dt:
06/21/2001
Assignees:
72 HORIKAWA-CHO, SAIWAI-KU
KAWASAKI-SHI, JAPAN
11-1 HANEDAASAHICHO, OHTA-KU
TOKYO, JAPAN
Correspondent:
FINNEGAN, HENDERSON, FARABOW, ET AL
MR ERNEST F. CHAPMAN
1300 I STREET NW
WASHINGTON, D..C 20005-3315

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