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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/27/2004
Application #:
10454081
Filing Dt:
06/04/2003
Inventors:
James Anderson, Gershon Akerling
Title:
HIGH POWER CHIP SCALE PACKAGE
Assignment: 1
Reel/Frame:
014312/0527Recorded: 07/28/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/30/2003
Exec Dt:
05/30/2003
Assignee:
1840 CENTURY PARK EAST
LOS ANGELES, CALIFORNIA 90067-2199
Correspondent:
JOHN A. MILLER
P.O. BOX 70098
ROCHESTER HILLS, MI 48307
Assignment: 2
Reel/Frame:
023699/0551Recorded: 11/30/2009Pages: 98
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/25/2009
Assignee:
1840 CENTURY PARK EAST
LOS ANGELES, CALIFORNIA 90067-2199
Correspondent:
CHRISTOPHER P. HARRIS
TAROLLI, SUNDHEIM, COVELL & TUMMINO LLP
1300 EAST NINTH STREET, SUITE 1700
CLEVELAND, OH 44114
Assignment: 3
Reel/Frame:
023915/0446Recorded: 02/10/2010Pages: 93
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/10/2009
Assignee:
1840 CENTURY PARK EAST
LOS ANGELES, CALIFORNIA 90067-2199
Correspondent:
CHRISTOPHER P. HARRIS
TAROLLI, SUNDHEIM, COVELL & TUMMINO LLP
1300 EAST NINTH STREET, SUITE 1700
CLEVELAND, OH 44114

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