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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/27/2004
Application #:
10084923
Filing Dt:
03/01/2002
Publication #:
Pub Dt:
03/06/2003
Inventors:
Osamu Taniguchi, Tomoko Miyashita, Yasuo Yamagishi, Koji Omote, Yoshihiko Imanaka
Title:
THIN-FILM CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND A VIA FORMED SUBSTRATE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
012643/0204Recorded: 03/01/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/19/2002
Exec Dt:
02/19/2002
Exec Dt:
02/19/2002
Exec Dt:
02/19/2002
Exec Dt:
02/19/2002
Assignee:
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN & HATTORI, LLP
DONALD W. HANSON
1725 K STREET, N.W., SUITE 1000
WASHINGTON, DC 20006

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