Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/03/2004
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Application #:
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10084761
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Filing Dt:
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02/20/2002
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Publication #:
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Pub Dt:
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08/22/2002
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Inventor:
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Hiroshi Sawada
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Title:
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SUBSTRATE CUTTING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 85, AZA NAWATEZAKI, MINAMIYAMADACHO, KUSATSU-SHI |
| SHIGA-KEN, JAPAN |
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| J. C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 85, AZA NAWATEZAKI, MINAMIYAMADACHO, KUSATSU-SHI |
| SHIGA-KEN, JAPAN |
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| J. C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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