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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/03/2004
Application #:
10394347
Filing Dt:
03/24/2003
Publication #:
Pub Dt:
01/29/2004
Inventors:
Chi Tsung Chiu, Ted Wang, Samuel Wu, Jenny Chen
Title:
SEMICONDUCTOR PACKAGE AND SUBSTRATE THEREOF
Assignment: 1
Reel/Frame:
013906/0830Recorded: 03/24/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/07/2002
Exec Dt:
11/07/2002
Exec Dt:
11/07/2002
Exec Dt:
11/07/2002
Assignee:
NO. 26, CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOSHIUNG, TAIWAN R.O.C.
Correspondent:
LOWE HAUPTMAN GILMAN, ET AL.
BENJAMIN J. HAUPTMAN
1700 DIAGONAL ROAD
SUITE 310
ALEXANDRIA, VA 22314

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