Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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09801699
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Filing Dt:
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03/09/2001
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Publication #:
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Pub Dt:
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10/11/2001
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Inventors:
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Jun Amako, Kazushige Umetsu, Hideo Tanaya
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Title:
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PACKAGE SEALING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE MODULES, SEALING APPARATUS, AND PACKAGED PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO, JAPAN |
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| OLIFF & BERRIDGE, PLC |
| JAMES A. OLIFF |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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