Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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09856350
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Filing Dt:
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05/18/2001
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Inventors:
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Shin-ichi Obata, Makoto Dobashi
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Title:
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ELECTRODEPOSITED COPPER FOIL WITH CARRIER, METHOD FOR PRODUCING THE ELECTRODEPOSITED COPPER FOIL, AND COPPER-CLAD LAMINATE FORMED BY USE OF THE ELECTRODEPOSITED COPPER FOIL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1 OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 141-8 |
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| JENKENS & GILCHRIST |
| HAROLD N. WELLS |
| 1445 ROSS AVENUE - SUITE 3200 |
| DALLAS, TX 75202-2799 |
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